Applied Materials Acquires ASMPT’s Advanced Packaging Business, Strengthening Panel-Level Plating Equipment Portfolio

Applied Materials recently signed an agreement to acquire the NEXX business unit from global semiconductor packaging equipment supplier ASMPT. NEXX specializes in panel-level plating equipment, a critical component of advanced packaging processes. The transaction does not require separate regulatory approval and is expected to close within months.

“NEXX’s addition will further strengthen Applied Materials’ leadership in panel processing and open a new chapter in advanced packaging technology,” said Prabhu Raja, President of the Semiconductor Products Group at Applied Materials. The acquisition expands Applied Materials’ advanced packaging portfolio, which includes wafer-level test equipment, and wafer-level and panel-level plating systems.

Previously, Applied Materials acquired a 9% stake in BESI and co-launched hybrid bonding equipment. It is also developing glass substrate processing tools and has joined the U.S. advanced packaging consortium Joint3 to accelerate panel-level packaging development. Industry observers see panel-level packaging and glass substrates as key trends in 2026. With this acquisition, Applied Materials is transforming from a traditional front-end equipment supplier into a one-stop packaging solution provider, reshaping the competitive landscape of advanced packaging equipment.