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Bosch Unveils New Ultrasonic Chipset, Redefining AI-Powered Intelligent Parking with Hardware Innovation

2026-05-06 14:37:57

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Beijing – At the 2026 Beijing Auto Show, Bosch unveiled its next-generation ultr

Beijing – At the 2026 Beijing Auto Show, Bosch unveiled its next-generation ultrasonic chipset, the TB193 and TB293, designed specifically for close-range vehicle perception. For the first time, the chipset enables direct processing of raw signals from ultrasonic sensors, delivering richer and more detailed environmental data to significantly enhance the accuracy and reliability of parking assist systems.

 

In China’s complex parking scenarios, traditional pre-processed information often falls short of meeting the demands of advanced intelligent driving. Bosch’s new chipset accesses unprocessed raw signals, capturing critical details such as curbs, pillars, wet or uneven road surfaces, and provides essential data for AI-powered parking systems to make high-level decisions such as intelligent braking.

 

“China is a hotbed of technological innovation,” said Wang Hongyu, Vice President of Bosch Automotive Electronics Semiconductors China. “Our seventh-generation ultrasonic chip delivers raw data with high precision and speed, providing the fundamental support for AI parking. By supplying chips independently and opening up the VASI bus, we offer local OEMs the architectural flexibility to create differentiated user experiences.”

 

The chipset features a dual-chip architecture: the TB293, mounted directly on the ultrasonic transducer, captures raw signals; the TB193 acts as a control chip, coordinating multiple sensors and pre-processing the collected data. The modular design supports scalable configurations, aligns with modern electrical/electronic architectures, and facilitates a smooth transition to software-defined vehicles. Data transmission reaches up to 1.16 Mbps, ensuring real-time processing without information loss. Power consumption is 50% lower than comparable solutions, with fewer peripheral components and 50% less weight. The chipset withstands temperatures up to 150°C, making it suitable for demanding installation environments.

 

“Raw sensor data opens the door to flexible evaluation and a wide range of applications,” said Hendrik Seidel, Head of Bosch’s ADAS business unit. Wang Hongyu concluded: “The combination of complete raw data, high-speed transmission, energy efficiency, and open interfaces enables automakers to develop assistance systems that can evolve into full autonomous driving functions. Safety remains the core priority, and Bosch is committed to translating complex hardware into safe, reliable intelligent mobility experiences.”


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Bosch Unveils New Ultrasonic Chipset, Redefining AI-Powered Intelligent Parking with Hardware Innovation
Beijing – At the 2026 Beijing Auto Show, Bosch unveiled its next-generation ultr
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