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ROHM Launches 600V Super-Junction MOSFETs in Surface-Mount Packages with Enhanced Thermal Performance

2026-06-22 16:02:59

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Shanghai, China – June 16, 2026 – ROHM Co., Ltd., a globally renowned semiconduc

Shanghai, China – June 16, 2026 – ROHM Co., Ltd., a globally renowned semiconductor manufacturer headquartered in Kyoto, Japan, today announced the release of new 600V super-junction MOSFETs: the R60xxXNx series and R60xxWNx series. Expanding on existing package options, ROHM has added two surface-mount packages – DFN8080-5L (8.0 mm × 8.0 mm × 0.85 mm) and TOLL (11.68 mm × 9.9 mm × 2.3 mm). The new devices offer a smaller, thinner footprint combined with excellent thermal dissipation, making them ideal for spaceconstrained, highpowerdensity applications such as AI servers and industrial power supplies.

 

In terms of characteristics, the gate threshold voltage (VGS(th)) is set in the widely used range of 3 V to 5 V, supporting a broad range of drive conditions. Improved transconductance characteristics deliver lower losses and greater versatility compared to previous series. The surfacemount packages are designed with a land pattern that offers good compatibility with standard devices, facilitating easy replacement in existing power circuits and secondsource selection.

 

The product lineup includes 21 highspeed switching models in the R60xxXNx series and 11 PrestoMOS™ models in the R60xxWNx series, featuring industryleading ultrafast reverse recovery characteristics. Customers can choose the optimal device based on application requirements.

 

Mass production of the new products began in June 2026 (sample price: 900 yen each, excluding tax). TOLLpackaged models (R6020XNJ2, R6038XNJ2, R6049XNJ2, R6055XNJ2, R6024WNJ2, R6035WNJ2) are now available through online distribution channels.

 

ROHM will continue to expand its superjunction MOSFET lineup, with plans to massproduce 650 V products and nextgeneration devices in the future.


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ROHM Launches 600V Super-Junction MOSFETs in Surface-Mount Packages with Enhanced Thermal Performance
Shanghai, China – June 16, 2026 – ROHM Co., Ltd., a globally renowned semiconduc
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