Renesas Electronics was the first to introduce a complete memory interface chipset solution for the second-generation DDR5 multi-rank dual in-line memory module (MRDIMM) for servers.

On November 20, 2024, in Beijing, China - Renesas Electronics (TSE: 6723), a global semiconductor solution provider, took the lead in launching a complete memory interface chipset solution for the second-generation DDR5 multi-rank dual in-line memory module (MRDIMM) on that day.

With the continuous increase in the demand for memory bandwidth in artificial intelligence (AI), high-performance computing (HPC), and other data center applications, the second-generation DDR5 MRDIMM has emerged. Its operating speed can reach up to 12,800 megatransfers per second (MT/s), and the memory bandwidth is increased by 1.35 times compared to the first-generation solution. Renesas Electronics actively cooperates with industry leaders such as CPU and memory suppliers and end customers, and has played a crucial role in the design, development, and deployment of the new MRDIMM.

Renesas has carefully designed and launched three new key components: the RRG50120 second-generation multiplexed registered clock driver (MRCD), the RRG51020 second-generation multiplexed data buffer (MDB), and the RRG53220 second-generation power management integrated circuit (PMIC). In addition, Renesas is also mass-producing temperature sensor (TS) and serial presence detect (SPD) hub solutions, and can provide a comprehensive chipset solution for various server and client DIMMs including the industry-standard next-generation MRDIMM. As an outstanding manufacturer in the field of memory interface, Renesas is always committed to providing users with high-quality and high-performance products and services.

Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing, said: "The demand for higher performance systems in AI and HPC applications is constantly growing. Renesas accurately grasps this trend and jointly develops next-generation technologies and specifications with industry leaders. These companies rely on Renesas' professional technical knowledge and production capacity to meet the growing demand. Our latest chipset solution for the second-generation DDR5 MRDIMM demonstrates Renesas' outstanding position in this market segment."

The RRG50120 second-generation MRCD of Renesas is used in MRDIMM and is mainly responsible for buffering the command/address (CA) bus, chip select, and clock between the host controller and DRAM. Compared with the first-generation product, its power consumption is reduced by 45%, which is a crucial indicator for the thermal management of ultra-high-speed systems. The RRG51020 Gen 2 MDB is another key device used in MRDIMM, and its function is to buffer the data from the host CPU to DRAM. Both Renesas' new MRCD and MDB support speeds of up to 12.8 gigabits per second (Gbps). In addition, Renesas' RRG53220 next-generation PMIC has excellent electrical overvoltage protection capabilities and outstanding energy efficiency performance, and is optimized for high-current and low-voltage operations.